Technology Hotbed · Semiconductors
Advanced Packaging
Data as of 12 Oct 2026Methodology
Momentum: ▲ Rising
Across fully-published filing years - the current year is still publishing and is left out of the signal.
9
Patents
0
Startups matched
2
Foreign filers
Startup counts are name-matched candidates, not ownership records - see methodology. Methodology
Where it clusters
Matched startups by state
No matched startups have surfaced a state for this technology yet - coverage is patent-only.
Filing momentum
Filings by year - recent years still publishing
| Year | Filings | Foreign |
|---|---|---|
| 2022 | 2 | 2 |
| 2023 | 2 | 2 |
| 2024 | 4 | 4 |
| 2025 | 1 | 1 |
Patents publish ~18 months after they're filed, so the current year is always incomplete. The Rising / Steady / Cooling signal ignores it and compares only fully-published years - read a dip in the latest year as data still coming in, not a decline.
Who's filing
Indian companies lead - institutes & foreign kept separate
No Indian companies have filed in this technology yet.
Foreign filers (2)
Top inventors in this technology
The most prolific inventors filing in this technology, each linking to their full patent history.
Briefings on this technology
tech brief
India's Semiconductor Import Bill: $9.4B From China, and Who's Actually Building the Alternative
India imported $9.4B in semiconductor devices from China in FY2024-25, 35% of its world imports in the category. Our patent and startup data shows exactly where domestic capability exists.
tech brief
India’s Advanced Packaging Innovation: Dense Interconnects, Compact Designs
From flip-chip reliability to high-bandwidth die-to-die links, Indian inventors are tackling the physical limits of chip packaging.