India’s Power Module Packaging: Shedding Wires, Taming Heat

The problems being solved

Power modules in electric vehicles, renewable energy, and industrial drives are pushing the limits of conventional packaging. The thin bond wires that connect semiconductor dies to terminals have become a bottleneck—they introduce parasitic inductance that causes voltage overshoots, and they are a common failure point under thermal cycling.

Indian inventors are homing in on a cluster of intertwined challenges. The first is interconnection reliability: replacing fragile wire bonds with robust, low-inductance links that can handle high currents without degrading. The second is thermal management: pulling heat out of high-power devices while keeping them electrically isolated and the module footprint small. A third is electrical isolation of embedded conductors—when you bury copper layers for cooling or current sharing, you must prevent short circuits without bulking up the package.

Mechanical integrity is another front. Modules warp during brazing, base plates bend, and molded bodies crack under repeated thermal stress. Inventors are also chasing space utilization, integrating capacitors and passive components directly into the module structure to shrink system size. Finally, assembly precision—aligning multiple dies, spacers, and terminals within tight tolerances—remains a persistent headache that directly impacts yield and performance.

How the field is solving it

The patent landscape reveals a clear shift away from wire bonds. One prominent approach uses conductive spacers or vertical interconnect structures that bridge height differences between devices and terminals, slashing loop inductance. Some designs go further, coupling a high-frequency capacitor directly across the switching loop to suppress voltage spikes.

Thermal management is being reimagined through embedding. Power semiconductors are placed inside insulating layers or grooves, enabling dual-sided cooling—heat is pulled from both the top and bottom of the die. Thin prepreg layers and ceramic substrates with improved thermal conductivity are being paired to maintain electrical isolation without choking heat flow.

To keep embedded conductors safe, inventors are applying localized isolation coatings—prepreg patches, insulating glues, or molded compounds that cover exposed copper only where needed. Mechanical reinforcement comes from fiber or mesh structures integrated into the module’s molded body, resisting crack propagation. For space savings, unibody conductive members connect passive components directly to substrates, eliminating separate busbars. Assembly precision is tackled with alignment slots, spacer layers that compensate for height variations, and pressing jigs that hold everything flat during brazing.

Where the market is heading

The global power module packaging market is in the low-single-digit billions of dollars today, with multiple research firms projecting double-digit annual growth as electrification accelerates. India’s own discrete power semiconductor and power module market was valued at roughly USD 1.9 billion in 2025 and is expected to grow at a double-digit CAGR, with power modules being the fastest-moving segment, according to PS Market Research.

Technology trends are reshaping what packaging must do. The shift from silicon IGBTs to wide-bandgap semiconductors like silicon carbide and gallium nitride is pushing operating temperatures and voltages higher, demanding new interconnect and substrate materials. Silver sintering is replacing traditional solder for die-attach, offering better thermal performance and reliability. Copper wire bonds and copper clips are gaining ground for lower resistance and improved heat spreading. Advanced ceramic substrates—silicon nitride and aluminum nitride—are becoming essential to handle the thermal load, as noted by Yole Group.

In India, silicon still dominates the material mix, but SiC and GaN adoption is expected to rise. The supply chain is also in flux: Asian packaging material players are entering, and reshoring efforts are creating opportunities for local innovation. The market remains fragmented, with no single dominant Indian player in global lists, but the growth trajectory and the push for higher power density are opening doors for new packaging approaches.

The white space

Even as wire-bondless and embedded designs mature, several opportunities remain wide open. Electromagnetic interference mitigation in high-current modules is still largely addressed by simple terminal shielding; there is room for integrated EMI suppression that doesn’t add bulk. Thermal interface materials and cooling structures that can handle extreme power densities—while maintaining the thin insulation layers needed for compact dual-sided cooling—are a fertile area.

Scalable manufacturing processes for embedded packaging are another gap. Many of the novel assembly techniques seen in patents need to be translated into high-volume, cost-effective production lines. Reliability testing methodologies tailored to these new interconnect and embedding methods, especially under harsh field conditions like vibration and humidity, are not yet standardized.

Integration of gate drivers, current sensors, or even protection circuitry directly into the module package is still nascent, offering a path to smarter, more compact power stages. For India, the combination of a fast-growing domestic market, supply chain realignment, and a strong base in automotive and industrial electronics creates a natural pull for packaging innovation that addresses these whitespaces.

Explore the innovators

The specific inventors, patents, and companies working on these challenges in India are diverse and active. Their work spans wire-bondless interconnects, embedded cooling, isolation coatings, and assembly jigs—each solving a piece of the power module puzzle. You can explore the full landscape of Indian deep-tech innovation in power module packaging on Deeptech Navigator, where problem themes, technical approaches, and the organisations behind them come into clear view.

In our data

Sources

• Why packaging is the next frontier in power design innovation ↗
• Perspective of power module packaging technology ↗
• Overview of Power Module Packaging Technologies ↗
• Power Module Packaging: From Components to Raw Materials 2026 ↗
• Power Module Packaging Evolves with Materials, Supply Chains ↗
• Power Module Packaging: Innovation is Reshaping the Supply Chain ↗
• Power Module Packaging Market Size, Share, Trends, Forecast 2030 ↗
• Power Module Packaging Market Size, Share & Growth Report 2035 ↗