Technology Hotbed · Semiconductors
power module packaging
Momentum: ▼ Cooling
14
Patents
0
Startups matched
9
Foreign filers
Startup counts are name-matched candidates, not ownership records — see methodology. Methodology
Where it clusters
Matched startups by state
No matched startups have surfaced a state for this technology yet — coverage is patent-only.
Filing momentum
2022 onward
| Year | Filings | Foreign |
|---|---|---|
| 2022 | 3 | 3 |
| 2023 | 5 | 5 |
| 2024 | 2 | 2 |
| 2025 | 3 | 3 |
| 2026 | 1 | 1 |
Who's filing
Indian companies lead — institutes & foreign kept separate
No Indian companies have filed in this technology yet.
Top inventors in this technology
The most prolific inventors filing in this technology, each linking to their full patent history.