Technology Hotbed · Semiconductors
Power Module Packaging
Data as of 11 Oct 2026Methodology
Momentum: ▼ Cooling
Across fully-published filing years - the current year is still publishing and is left out of the signal.
16
Patents
0
Startups matched
10
Foreign filers
Startup counts are name-matched candidates, not ownership records - see methodology. Methodology
Where it clusters
Matched startups by state
No matched startups have surfaced a state for this technology yet - coverage is patent-only.
See power module packaging on the India map → Where its patents are filed, state by state and city by city, with companies, institutes and individual inventors apart.
Filing momentum
Filings by year - recent years still publishing
| Year | Filings | Foreign |
|---|---|---|
| 2022 | 3 | 3 |
| 2023 | 5 | 5 |
| 2024 | 2 | 2 |
| 2025 | 3 | 3 |
| 2026partial | 1 | 1 |
Patents publish ~18 months after they're filed, so the current year is always incomplete. The Rising / Steady / Cooling signal ignores it and compares only fully-published years - read a dip in the latest year as data still coming in, not a decline.
Who's filing
Indian companies lead - institutes & foreign kept separate
No Indian companies have filed in this technology yet.
Top inventors in this technology
The most prolific inventors filing in this technology, each linking to their full patent history.